Mi Equipment is a Leading Semiconductor Equipment Solutions Provider, offering advanced
AI Enabled Die Sorting & Smart Binning, Wafer Reconstruction, Precision Bonding, Laser Bonding, Test Handling,
AI Vision Inspection and Smart Factory platforms through our Mi, Ai, Si and Vi series of products serving the
Mobility & Wearables, HPC & Memory and Automotive & Renewable Energy segments.
We have strong global presence with world class R&D centers and manufacturing facilities in Malaysia and China as well Sales & Service networks covering Asia, North & Central America and Europe. We are proud to be part of Mi Technovation Berhad.
Leading & Contributing to Global Cutting-Edge Semiconductor Equipment & Process with Innovation and Excellence.
To be a beacon of progress for our clients and stakeholders within the semiconductor value chain through:
To offer fair returns to our employees, suppliers & shareholders, facilitating ongoing investments and promoting sustainable growth; extending beyond mere profit.
President & CEO
Chief Financial Officer
Chief Technical Officer
Chief Operations Officer
Vice President (HR & Administration)
*Follow our growth trajectory and click on any milestone to discover our achievements













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