Fully Integrated Precision Laser Compression Bonder (LCB)
Ai Series
For HPC and Memory Solution
- Enabling Technology for Large Body Size, Warpage Sensitive, Narrow Pitched packages - Must Have!
- Better warpage tolerance - up to 400um!
- Wafer/Waffle Pack Input
- Integrated Flux Dipping - Die Placement - Laser Bond - All in One!
- Localized heating with built-in Bonding Force and Height Control
- Uniform device temperature ensures good bonding!
Compression Laser Assisted Bonding (ZLAB) & LAB
Ai Series
For HPC and Memory Solution
- ZLAB is LAB with Added Bond Force Control!
- Direct integrates into existing FC border line
- Unparallel performance for warpage sensitive package and narrow pitch device
- LAB a great option for narrow pitched FCCSP/SIP application!
