MiND.X (AI) Enabled Die Sorter
Mi Quantum and Quantum Plus
For Mobility and Wearables WLCSP Solution
- Most Advanced AI and Industrial 4.0 Driven Platform!
- Market Leading UPH > 50K UPH!
- MiND.X enabled Vision Platform - Reduce Overkill & Underkill!
- 9S AOI - 6S Optical + Sidewall IR, Backside IR and Latest Laser Groove IR AOI (available in Quantum Plus Platform)!
- Most Flexible platform - with Dual Track, De-taper options
- Big Die Size Platform, up to 16x16mm and 35x35mm, both available!
- Industrial 4.0 Automation Available with Auto Cassette and Auto Reel Change Platform - One of its Kind!
- Fast Conversion, Poka-yoke and Self Diagnostics Health Check Platform!
High Speed Attach
(Pre-EMI Sputtering)
Mi10 Series
For Mobility and Wearables EMI Shielding Solution
- Tray or Film Frame Input
- Flip option available upon request
- Market Leading UPH
- Coupled with Pressing Module to meet bond force
- Equipped with 6 Side AOI
- Wide device size range
Multi-functional EMI Shielding Inspection & Sorting Handler
Mi28 Series
For Mobility and Wearables EMI Shielding Solution
- Market leading UPH
- Capable of handling multiple package sizes
- Equipped with Advanced Automatic Optical Inspection (AOI)
- 3D & IR Inspection Available
- Inline detaping and re-taping capability
- Supports multiple tape & reel formats
- Designed for high-volume EMI shielding inspection flow
Smart Multi-Bin Sorting
Mi Series
For Mobility and Wearables Sensor and Display Solution
- Wafer to Wafer Platform
- Design to enable Multiple Bin Sorting - up to 10 bins!
- Multiple Output Cassettes format to cater for multiple bin sorting efficiency
- 6S Advanced Sensor and Display level AOI available!
- Industrial Automation ready - incorporating auto wafer cassette handling
- Thin die capability
- Class 100
Die Sort with Smart Binning & Advanced AOI
Mi28W Wafer to Wafer
Mi18 Wafer to Waffle Pack
For HPC and Memory Solution
- Your solutions to Multi Bin sorting! Every bin counts.
- Up to 38 bins Sorting for waffle pack output!
- Both models suited to address your next process and control needs - sort the multi bins to wafer or
waffle pack
- Equipped with 6 Side AOI
Smart Multiple Bin Sorter
Mi Series
For Automotive and Renewable Energy Solution
- For SiC post KGD Multiple Bin Sorting
- Market Leading UPH
- Wafer Input to Multiple Tape and Reel
- 4 to 8 Tape & Reel available!
- Advanced AOI incorporated
- Detaper available to TnR or Wafer!
