HPC and Memory Solution

Your solutions to Multi Bin sorting! Every bin counts.
Up to 38 bins Sorting for waffle pack output!
Both models suited to address your next process and control needs - sort the multi bins to wafer or waffle pack
Equipped with 6 Side AOI

Enabling Technology for Large Body Size, Warpage Sensitive, Narrow Pitched packages - Must Have!
Better warpage tolerance - up to 400um!
Wafer/Waffle Pack Input
Integrated Flux Dipping - Die Placement - Laser Bond - All in One!
Localized heating with built-in Bonding Force and Height Control
Uniform device temperature ensures good bonding!

Infra-red inspection on die back to check for cracks
Mi proprietary smart vision MiND.X option available for self-learning capability. Effectively reduce dependency on human eyes for decision - less underkill/overkill!
Optical inspection available
Ensure process compliance!