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Mobility and Wearables WLCSP Solutions
MiND.X (AI) Enabled Die Sorter
Mi Quantum and Quantum Plus
Most Advanced AI and Industrial 4.0 Driven Platform!
Market Leading UPH > 50K UPH!
MiND.X enabled Vision Platform - Reduce Overkill & Underkill!
9S AOI - 6S Optical + Sidewall IR, Backside IR and Latest Laser Groove IR AOI (available in Quantum Plus Platform)!
Most Flexible platform - with Dual Track, De-taper options
Big Die Size Platform, up to 16x16mm and 35x35mm, both available!
Industrial 4.0 Automation Available with Auto Cassette and Auto Reel Change Platform - One of its Kind!
Fast Conversion, Poka-yoke and Self Diagnostics Health Check Platform!
Reel to Reel IR Inspection
Vi Series
Reel to Reel IR inspection
High UPH
MiND.X upgradeable to extend inspection capability!
Most reliable QC and RMA platform
Optical Inspection included to complete multi-faceted inspections