Final Test handler
Si10 was designed for WLCSP post sawn test application in singulated die format. Die was picked from Sawn wafer for direct docking test and 5S-AOI follow by tape and reel process.
Maximum 12” wafer handling capability.
Reel input with De-taping module.
Direct docking test capability with multiple sites.
Full inspection for die back and front active area with minimum 6 cameras vision system.
Vision system with Side wall inspection.
Ideal tool for post sawn test application.
Enhance Post seal inspection.
Reject bad die to wafer pack.
Optional input/output : Jedec tray and Waffle pack.
[Please contact us for more information]