Tape & Reel Map Sorter
State of art Die Sorting machine for WLCSP product, wafer to reel with the option of side wall inspection, laser marking and cable docking test function.
Maximum 12" wafer.
Unique mechanical design provide high throughput 
up to 25K UPH with flipping and inspection.
Ideal tool for sorting application form wafer to carrier tape for bare die, bumped/flip chips and WLCSP.
Full inspection for die back and front active area with minimum 6 cameras vision system.
Vision system with Side wall inspection.
Laser marking option.
Cable docking test capability.
[Please contact us for more information]