Tape & Reel Map Sorter
Mi30 series is the next generation die sorting machine with higher UPH and throughput which target for better ROI. Mi30 can also be configured to have side wall inspection (5S) and soft docking test function.
Maximum 12" wafer.
Unique mechanical design provide high throughput 
up to 30K UPH with flipping and inspection.
Ideal tool for sorting application from wafer to carrier tape for bare die, bumped/flip chips and WLCSP.
Full inspection for die back and front active area with minimum 6 cameras vision system.
Vision system with Side wall inspection.
Laser marking option.
Cable docking test capability.
IR inspection capability.
[Please contact us for more information]